From the latest wafer designs to ceramic components and everything in between.
With cut depths of up to 13mm, the NANOAC 3300 has all your dicing requirements covered.Fitted with Loadpoint’s NanoControl, it has the flexibility for prototype trials and small batch runs and the automatic processes for larger production runs.DC brushless drive 1.2kW , 3,000 to 60,000 rev per minute.The extremely low vibration improves the quality of the machine cutting and can satisfy the customer's demand.Based on the Windows operating system and the complete 17-inch monitor, the coordinates of X,Y,Z and theta and spindle current are continuously displayed, and the simple human interface greatly facilitates the operation of the machine.In addition, the machine work scope can reach 300*300* 13mm, whether from precision or efficiency, it is the best in the industry.
Application |
Silicon wafers, silicon wafer composites, Glass, MEMs structures, Ceramics, Photonics
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Work area |
H |
60mm |
L |
300mm |
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W |
300mm |
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Blade |
2”,3” 50,76mm
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Chuck-type |
Ceramic or metal vacuum, tapeless jig, mechanical vice, magnetic vice
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Spindle |
2.4kw 60,000rpm/min |
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Z axis resolution |
0.0001 mm |
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θ |
360°(Continue to rotate) |